Industrial, Medical & Consumer Electronics


Chip On Glass	Chip On Board	Chip On Tab		Chip On Film


The chip is mounted directly on the contact edge on the LCD.	The driver chip is mounted on a PC board. The board is typically compressed to the LCD with a zebra connector and the package is held together with a bezel.	The driver chip is installed on a flexible film.		The driver chip is installed on a flexible film.

Chip On Glass Module				Technology
Polytronix COG modules are available in a variety of standard character and graphic sizes. They feature high contrast TN, STN and FSTN technology and are available with Hot Bar, Zif & Through Hole connections, allowing maximum flexibility in your assembly process. COG module technology is ideal for applications requiring a very thin package. Gold bumped driver IC’s are bonded directly to the glass edge eliminating the need for an additional pcb, bezel and connector. A variety of backlight solutions are available for Polytronix COG Modules such as EL, CCFL & LED. As it is our quest to provide cost effective display solutions that will fit your need, Polytronix will custom design a COG module to meet your specification. Our custom capabilities are backed by a full staff of Engineers located at our Richardson, Texas headquarters and a state of the art COG manufacturing process. Below is an example of a COG Module and the material breakdown.
				Technology: COG/TAB Min. dot gap: 0.015mm, 0.02mm (preferred) Min. dot pitch: >0.2mm (recommended) Top: -20~+70 (STN & FSTN)


Chip On Board Module				Technology
The general term for COB technology is actually 'direct chip attachment,' or DCA. Aside from circuit boards used for COB's, various substrates are available for use in DCA. There are, for instance, ceramic and glass ceramic substrates which exhibit excellent dielectric and thermal properties. Organic substrates that weigh and cost less while providing a low dielectric constant also exist. The COB process consists of just three major steps: 1) die attach or die mount; 2) wirebonding; and 3) encapsulation of the die and wires. A variant of COB assembly, the flip-chip on board (FCOB), does not require wirebonding since it employs a chip whose bond pads are bumped, which are the ones that connect directly to designated pads on the board. As such, FCOB's have their chips facing downward on the board (hence the name 'flipchip'). Aside from encapsulation, it is also necessary to 'underfill' a flip chip to protect its active surface and bumps from thermo-mechanical and chemical damage. Below is an example of a COB Technology and the material breakdown.
				Standard Character Modules: from 81 to 404 Standard Graphic Modules: 122*32 dots to QVGA Technology: COB TN: ≤1/4 duty HTN: ≤1/16 duty STN&FSTN: >1/16 duty (or smaller, according to customer’s requirement) ~ 1/240 duty Top: TN / HTN: -30~+85 (some meet -40~+90) STN&FSTN: -20~+70


Chip On TAB Module				Technology
Tape Automated Bond (TAB)Tape Automated Bonding involves bonding a gold bumped die to a single layer circuit built on a flexible material, such as polyimide. TAB is used primarily in the flat panel display industry to mount driver chips between the glass of the display and the input circuitry behind the display. The flexible circuit used in TAB allows for the package to be bent up to 180°. TAB is also utilized as a package format for Multi Chip Modules (MCM). In this format, the die and some of the leads are punched from the tape, the leads are formed, and the package is mounted similar to a J-Lead package. In some cases, the leads are not formed, but are soldered directly to the board. Chip Supply is supplying programs in the flat panel display industry and MCM industry with TAB product. Below is an example of a punched TAB circuit and a material breakdown on TAB Module.
				Technology: COG / TAB Min. dot gap: 0.015mm 0.02mm (preferred) Min. dot pitch: >0.2mm (recommended) Top: -20~+70 (STN & FSTN)
			Customized Modules

Chip On Film Technology
Chip-On-Film (COF) is a new technology after Tape-Automated Bonding (TAB) and Chip-On-Glass (COG) in the interconnection of liquid crystal module (LCM). The thickness of the film, which is more flexible than TAB, can be as thin as 44 μm. It has pre-test capability, while COG does not have. It possesses great potential in many product fabrication applications.